Huawei is set to announce their new Kirin 970 SoC tomorrow at IFA Berlin 2017, according to a report from the German news website WinFuture.de.
The new SoC is said to be based on 10nm manufacturing process, in-line with the competition from Exynos, MediaTek and of course Snapdragon. The Kirin 970 is said to have 8 CPU cores, 12 GPU cores and a dual ISP.
With 5.5 billion transistors, it has reportedly exceeded the Snapdragon 835 by 2.5 billion. Transistor count isn’t all that matters, however, especially once you consider that the Kirin 960 had 4 billion transistors and is a generation behind the Snapdragon 835. That isn’t to say Kirin isn’t capable of putting up a fight, as the Kirin 960 actually outclassed the Snapdragon 820 in single core performance. The Snapdragon 820 won out thanks to its graphics capabilities and multi-core performance, as expected given Qualcomm’s steadfast dominance in graphics thanks to the Adreno GPU line. The Kirin has always been a serious contender, however.
What’s more, this chip is reportedly armed with advanced artificial intelligence computing capabilities, advertised to be 25 times faster than a normal CPU core and 50 times more efficient. It seems that with the Kirin 970, Huawei wants to integrate better and more powerful artificial intelligence into its devices — once more in line with what’s being increasingly offered by competitors. This can only be a good thing, as artificial intelligence can learn a user’s tendencies, as we’ve seen in some Huawei devices. This can be used for preloading applications, helpful notifications and more, though we have yet to see truly noticeable improvements through these kinds of implementations.
We’ll be keeping an eye out on the Kirin 970 to see when it launches. We expect to see it debut in the Huawei Mate 10 which should be launching in the next few months. It’s always nice to see more chipsets and competition, so we can’t wait to see what HiSilicon will be offering.
Source: WinFuture
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